Product Description
- Electronic components material purchasing.
- Bare PCB fabrication.
- PCB Assembly Service. (SMT, BGA, DIP).
- FULL Test: AOI, In-Circuit Test (ICT), Functioal Test (FCT).
- Cable, Wire-harness assembly,sheet metal,Electrical cabinet Assembly service.
- Conformal coating service.
- Prototyping and mass production...
- Application: intelligent mobile terminal
- Number of layers: 12 layers of 3 level HDI board
- Plate thickness: 0.8mm
- Line width line distance: 2/2mil
- Surface treatment: gold +OSP
- Application: intelligent navigation module
- Number of layers: 8 layers of 2-stage HDI boards
- Plate thickness: 1.0mm
- Line width line distance: 3/3mil
- Surface treatment: gold +OSP
- Application: intelligent mobile terminal
- Layers: 10 ELIC
- Plate thickness: 0.8mm
- Line width line distance: 3/3mil
- Surface treatment: gold +OSP
