Product Specification:
| Layers | 1-32layers |
| Materials | CEM1,CEM3,Teflon,Rogers,FR-4,High Tg FR-4,Aluminum Base,Halogen Free |
| Max. Board Size | 510*1200mm |
| Material | RoHS Directive-compliant |
| PCB thickness | 1.6 ±0.1mm |
| Out Layer Copper Thickness | 1-6oz |
| Inner Layer Copper Thickness | 1/2oz-5oz |
| Max. board Thickness | 6.0mm |
| Minimum hole size | 0.20mm |
| Minimum line width/space | 3/3mil |
| Min. S/M Pitch | 0.1mm(4mil) |
| Plate thickness and aperture ratio | 30:1 |
| Minimum hole copper | 20µm |
| Hole dia. Tolerance(PTH) | ±0.075mm(3mil) |
| Hole dia. Tolerance(NPTH) | ±0.05mm (2mil) |
| Hole position deviation | ±0.05mm (2mil) |
| Outline tolerance | ±0.05mm (2mil) |
| Surface finished | HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver |
| Solder mask | green |
| Legend | white |
| Outline | rout and score/V-cut |
| E-test | 100% |
| Inspection standard | IPC-A-600H/IPC-6012B, Class 2 |
| Outgoing reports | final inspection, E-test, solderability test, micro section and more |
| Certificates | UL (E315391), ISO 14001, TS16949, ISO 9001, SGS |
PCB assembly OEM service
- Electronic components material purchasing.
- Bare PCB fabrication.
- PCB Assembly Service. (SMT, BGA, DIP).
- FULL Test: AOI, In-Circuit Test (ICT), Functioal Test (FCT).
- Cable, Wire-harness assembly,sheet metal,Electrical cabinet Assembly service.
- Conformal coating service.
- Prototyping and mass production...
Shipping Information
- Electronic components material purchasing
- Bare PCB fabrication
- PCB Assembly Service. (SMT, BGA, DIP)
- FULL Test: AOI, In-Circuit Test (ICT), Functioal Test (FCT)
- Cable, Wire-harness assembly,sheet metal,Electrical cabinet Assembly service
- Conformal coating service
- Prototyping and mass production...
Main Export Markets
- - Asia
- - Australasia
- - Central/South America
- - Eastern Europe
- - Mid East/Africa
- - North America
- - Western Europe
FAQs
- PCB layout, PCBA design according to your idea
- PCBA copy/clone
- Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design
- Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming
- Embedded User Interface Design / lSystem Hardware Design...
Testing Services
- 1.Evaluation of customer requirements
- 2.Design for Testability (DFT)
- 3.Design for Excellence （DFX) Analysis
- 4.Virtual Prototyping-Valor Software
- 5.Testability guidelines provided
- 6.Functional Testing & Development
- 7.In-Circuit Testing & Development
- 8.Dynamic burn-in with full temperature cycling
- 9.Troubleshoot to component level
- 10.Engineering Services
PCBA ODM service
- PCB layout, PCBA design according to your idea
- PCBA copy/clone
- Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design
- Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming
- Embedded User Interface Design / lSystem Hardware Design...
Shipping Information
| FOB Port | Shenzhen |
| Weight per Unit | 0.8 Kilograms |
| HTS Code | 8534.00.90 00 |
| Export Carton Dimensions L/W/H | 58.0 x 58.0 x 1.8 Centimeters |
| Lead Time | 15–20 days |
| Dimensions per Unit | 25.0 x 20.0 x 0.6 Centimeters |
| Units per Export Carton | 40.0 |
| Export Carton Weight | 2.0 Kilograms |
